Chinese wafer producer HaiNa Semiconductor plans to build semiconductor-grade polishing wafer production lines with RMB2 billion

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By Kate Yuan

(JW Insights) Jun 13 -- Chinese wafer producer HaiNa Semiconductor (海纳半导体) signed an agreement with Pujiang Economic Development Zone in eastern China’s Zhejiang Province to build semiconductor-grade polishing wafer production lines there, its parent company UniTTEC (合众科技) announced on June 12.

With an investment of about RMB2 billion ($279.63 million), the project will be built in two phases. The first phase, costing RMB1 billion, will be divided into two sub-projects. The first sub-project will invest approximately RMB500 million to build 4-6 inch high-end power device semiconductor-grade polishing wafer production lines, capable of producing 2.6 million per year. The second phase will cover the construction of semiconductor industry-related projects, which will be launched based on the progress of the first phase.

This is a major project introduced by Pujiang County, and the first phase will enjoy local supporting policies.

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